CASE STUDIES
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Supercomputing Heat Dissipation Module Solution
Jan. 01, 1970
Industry:
Supercomputing / Data Center
Project Background:
Supercomputing equipment has extremely high power density, requiring a heat dissipation module with three-material welding, which is technically challenging.
Solution:
Using three-material FSW welding technology to achieve high-quality joining of aluminum, copper and other dissimilar materials, meeting the cooling needs of supercomputing equipment.
Project Outcome:
Successfully delivered to multiple clients; features excellent heat dissipation performance and stable operation.
None
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