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Semiconductor Equipment Copper Backplane Solution
Jan. 01, 1970
Customers:
ULVAC, Konfoong Materials | Industry: Semiconductor Equipment
Project Background:
Semiconductor equipment has extremely high requirements for copper alloy component welding quality. Traditional welding is prone to defects that affect equipment stability and lifespan.
Solution:
Using copper alloy high-quality FSW welding technology to achieve defect-free welding of copper backplanes, meeting the high reliability requirements of semiconductor equipment.
Project Outcome:
The product has passed rigorous customer validation and has been designated as a core supplier.
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+86 177 1265 6888 （WhatsApp）
+86 137 7167 8566 （WhatsApp）
Peter Fu peter@dyf-sz.cn
Eva Zhou deyanfumachinery@gmail.com
Building 3, No. 28 Xinchang Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province
