CASE STUDIES
Build a highly cohesive team of thermal management, special welding and precision manufacturing
AI Computing Server Liquid Cooling Solution
Jan. 01, 1970
Industry
AI Computing / Data Center
Project Background
AI large model training brings ultra-high power density cooling challenges. Traditional air cooling cannot meet the cooling needs of GPU clusters, requiring a full liquid cooling fanless microchannel cold plate solution.
Solution
Using aluminum alloy + microchannel cold plate structure + FSW joining technology. The product is fully liquid-cooled without fans, suitable for ultra-high power density AI scenarios, quickly removing heat.
Project Outcome
Successfully applied to servers, with cooling performance meeting design requirements and large-scale stable mass production achieved.
None
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Build a highly cohesive team of thermal management, special welding and precision manufacturing
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LET’S CONNECT
LET’S CONNECT
+86 177 1265 6888 （WhatsApp）
+86 137 7167 8566 （WhatsApp）
Peter Fu peter@dyf-sz.cn
Eva Zhou deyanfumachinery@gmail.com
Building 3, No. 28 Xinchang Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province
