CASE STUDIES
Real-World Solutions - How We Help Our Partners Succeed
Case Studies
We provide high-precision heat dissipation components, such as microfluidic cold plates, for use in AI servers and high-power semiconductor lithography equipment, solving their efficient heat dissipation problems.
AI Computing Server Liquid Cooling Solution
Project Background: AI large model training brings ultra-high power density cooling challenges. Traditional air cooling cannot meet the cooling needs of GPU clusters, requiring a full liquid cooling fanless microchannel cold plate solution.
5G Base Station Radiator Solution
Project Background: 5G base station equipment has high power density and strict cooling requirements, while also requiring lightweight design to reduce installation and transportation costs.
Project Background: New energy bus battery trays need to withstand complex loads while meeting lightweight and high sealing requirements. Traditional welding processes struggle to balance both.
Semiconductor Equipment Copper Backplane Solution
Project Background: Semiconductor equipment has extremely high requirements for copper alloy component welding quality. Traditional welding is prone to defects that affect equipment stability and lifespan.
Supercomputing Heat Dissipation Module Solution
Project Background: Supercomputing equipment has extremely high power density, requiring a heat dissipation module with three-material welding, which is technically challenging.
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We provide high-strength, well-sealed core components for new energy vehicles that meet global automotive standards. Schedule a rapid technical consultation now.
Build a highly cohesive team of thermal management, special welding and precision manufacturing
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LET’S CONNECT
LET’S CONNECT
+86 177 1265 6888 （WhatsApp）
+86 137 7167 8566 （WhatsApp）
Peter Fu peter@dyf-sz.cn
Eva Zhou deyanfumachinery@gmail.com
Building 3, No. 28 Xinchang Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province
